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Thermistor Braze and Reflow Procedure

IP.com Disclosure Number: IPCOM000039069D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Interrante, M Ray, SK Reeber, MD Williams, DE [+details]

Abstract

A procedure has been developed for using a new gold-tin alloy braze to attach thermistors to pads on substrates in thermal conduction modules (TCMs). A reflow procedure uses a continuous-wave CO2 laser to reflow the thermistor braze paste during rework procedures. In the manufacture of semiconductor modules, thermistors with platinum wiring have to be attached to pads on the TCM substrate. Prior methods used ultrasonic bonding which required heavy gold plating. A new brazing material 82/18 Au/Sn has characteristics which enable it to be bonded to the thermistor pads during pin braze to provide a suitable bonding material for the platinum thermistor wire.