Browse Prior Art Database

Thermal Sponge

IP.com Disclosure Number: IPCOM000039093D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Kang, SK Ledermann, PG Moskowitz, PA [+details]

Abstract

A cooling structure for VLSI chips is disclosed and comprises a thermal sponge having a mixture of a solder and solid particles of a highly conductive pure metal, wherein the solder is chosen according to its melting point such that the melting point corresponds to the desired operating temperature of the chip. The thermal sponge is placed in a recess in a substrate and is directly adjacent to the location of where the chip is to be attached. The provided cooling structure is both conformal and highly thermally conductive as opposed to the rigid high thermal conductivity couplers of the art and the low thermal conductive conformal grease, cement or solder couplers of the art. The thermal sponge and cooling structure are seen in the figure.