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Module Mating Tool for Zero-Insertion-Force Connector

IP.com Disclosure Number: IPCOM000039138D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Scott, GW [+details]

Abstract

A zero-insertion-force (ZIF) connector is achieved by amplifying an applied force to either mate/unmate the connector or to preopen normally closed contacts/close normally open contacts. Connectors for high input/output pin grid array chip carriers typically use a cam or wedge elements within the connector to amplify the force applied. To minimize the load transmitted to the solder connections, the connector housing is rigidly fastened to the wiring board under the connector. Both amplification of the applied force and retention of the housing can be performed by use of a separate tool. Removing the amplifying mechanism from the connector body allows a lower connector profile and a smaller board area for the connector. The tool works as follows. (Image Omitted) The tool 1 (Fig. 1) is placed over a module 2 (Fig.