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Ceramic Chip Capacitor Fusing Mechanism

IP.com Disclosure Number: IPCOM000039152D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Morrison, JD Serisky, PC [+details]

Abstract

An internal fusing mechanism is disclosed for fused ceramic chip capacitors used in semiconductor devices. The internal aspect, as opposed to conventional externally fused devices, permits the part to be dipped in SnBi solder. Ceramic bulk decoupling capacitors designated by 1 in Fig. 1 are used for high frequency applications due to their inherently high resonant frequencies. The internal fuse mechanism designated by elements 2, 3 and 4 is surmounted with a protective coating 5, with the plates 6 of the capacitor surrounded with a Pd/Ag paste 7. A Ni barrier 8 and Au coating 9, to prevent oxidation, complete the capacitor which may then be dipped in Sn/Bi solder 10. (Image Omitted) The structure of the fuse mechanism, shown in Fig. 2, includes Ti/W 2, Al 3, and Pd/Ru 4.