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Flexible Leaded Chip Carrier Disclosure Number: IPCOM000039154D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

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Arndt, SF Beaman, BS Drotar, JS Funari, J [+details]


Disclosed is a module with flexible leads for mounting to a card used in semiconductor devices. The design replaces a high I/O pin array method of connecting circuitry to cards with a first level integrated circuit (IC) package having flexible Cr/Cu-plated polyimide (PI) film leads. Referring to the figure, the module includes the flexible PI leadframe 1 having a rectangular ceramic base plate 2. A controlled collapse chip connection (C-4) attachment 3 along with IC chip 4 are shown located within the module. Two types of chips can be mounted--C-4 or wire bondable. Cr/Cu circuitry 5 is provided along with suitable surface solder pads 6 for connection to a PC board. A ceramic lid 7 assures an hermetically sealed package.