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Thermal Conduction Module With Dielectric Liquid and Finned Pistons for Improved Heat Transfer Disclosure Number: IPCOM000039170D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

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Chu, RC [+details]


A thermal conduction module (TCM) is filled with a non-boiling fluorocarbon dielectric liquid, and suitable means is provided to remove heat from the fluorocarbon. The pistons of the TCM are provided with fins in the region where the pistons extend beyond the apertures in the hat. The fins improve the heat transfer from the pistons to the dielectric liquid and thereby reduce the temperature of the pistons and improve the transfer of heat across the high thermal impedance of the chip to piston interface. A TCM is described in U. S. Patent 4,226,281. One separable section of a TCM has a chip carrier, an array of chips on one surface of the chip carrier, and an array of electrical connector pins on the opposite surface.