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In Situ Forming Stand-Off Interconnection

IP.com Disclosure Number: IPCOM000039179D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Ecker, ME Olson, LT [+details]

Abstract

A method is provided for effecting a stand-off connection for surface mountable components/hybrid pin wire loop connections. The loop is formed so as to provide a protrusion of the wire a fixed distance above the surface of the wiring structure by a device that works as follows. (Image Omitted) As seen in Fig. 1, a wire feed assembly 1 dispenses insulated copper wire 2 into an adhesive 3 which is applied to the surface of a printed circuit card 4. An ultrasonic anvil 5 trails the wire 2 and embeds wire 2 into adhesive 3 which is a partially cured resin. A blade 6 severs the wire 2 when desired. The anvil 5 consists of two halves which move independently and contain grooves 7 so that anvil 5 acts as a wire-forming die set.