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Thermal Conduction Module With Integrated Cold Plate and Individual Cylinders for Pistons Disclosure Number: IPCOM000039184D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue


Related People

Eid, JC Zumbrunnen, ML [+details]


A Thermal Conduction Module (TCM) has a chip carrier and a metal structure called a hat that is attached to the chip carrier and forms part of an enclosure for chips on the chip carrier. Metal pistons are carried in the hat and are spring-loaded to contact the chips for heat transfer to the hat. In this TCM, the pistons are carried in metal cups that are located in holes in a metal support plate that forms the hat surface that faces the chips. The cups are brazed to the support plate. A cover is attached to the support plate to form an enclosure for chilled water that contacts the walls of the cups for cooling the pistons. The cups can be brazed to the support plate at angles to match any tilt in the chips with respect to the chip carrier.