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Immersion-Cooled Circuit Package With Compliant Piston Mounted Between Similarly Positioned Chips on Facing Circuit Boards

IP.com Disclosure Number: IPCOM000039202D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Chrysler, GM Eid, JC Zumbrunnen, ML [+details]

Abstract

Circuit boards are located in parallel planes in an enclosure and are emersed in a dielectric cooling liquid held in the enclosure. The boards carry similar arrays of semiconductor chips, and pairs of chips on adjacent boards face each other. A symmetrical two-part piston structure is located between each pair of chips. The two parts are spring-loaded to maintain suitable pressure on the chips for heat transfer from a chip to a piston part. The pistons have fins for transferring heat to the dielectric liquid. A planar structure is located between the boards to hold the pistons in position during assembly. The face of a piston is concave to extend around the edge of a chip to form a seal. The drawing shows two piston parts 2 and 3, fins 4, the cavity 5 in the face of the piston, and a spring 6.