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Reduction in Shorts/Space Defects at Additive Plate

IP.com Disclosure Number: IPCOM000039203D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Burnett, PA Day, MA Kaschak, RA Tisdale, SL Vlasak, GP [+details]

Abstract

A dual-bath process for plating electroless copper is desirable when the plating surface must first be sensitized to accept the copper. The first bath initiates copper plating on a catalytic surface, and a second bath plates the copper to the desired finished thickness. This dual bath system operates with interrupted plating and, as such, it produces high flaring defects which are related to poor photoresist adhesion. This poor adhesion allows the plating solution to contact the catalytic surface in the areas adjacent to the circuit lines and plate under the photoresist, causing potential shorts.