Browse Prior Art Database

Circuit Module With Evaporative Cooling From Sintered Coating on Pistons

IP.com Disclosure Number: IPCOM000039204D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Eid, JC Zumbrunnen, ML [+details]

Abstract

Metal pistons are held in contact with semiconductor chips for cooling, as is known. These pistons have an outer coating of a porous material, such as a sintered metal, and have internal passageways for directing an evaporative liquid, such as a fluorocarbon, into the coating. A gas, such as dry air, is directed across the pistons to carry the vapor to a condenser. The gas and vapor circulate in a closed loop. The coating may be in the form of fins. The drawing shows a chip carrier 2, a chip 3, piston 4, sintered fins 5, passageways 6 in the pistons, piston springs 7, and a reservoir 8 that carries the liquid to the pistons. A condenser is not shown in the drawing.