Mechanism for the Accurate Registration and Alignment of Automatically Collated, Multi-Layered Stacks
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01
The lamination process of multi-layered circuit boards requires that sheets of FIBERGLAS* cloth substrate be collated with copper-clad laminates. The collated stacks are then layed-up according to a specified sequence prior to entering the lamination press. The automation of this (LAY-UP) process necessitates the accurate registration and alignment of the automatically collated stacks. Moreover, repeatability, reliability, and availability are essential in any automated system. The mechanism shown in the figure uses concepts of gravity, friction, and spring forces for the accurate positioning and alignment of the collated packages.