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Variable Geometry Multiple Robotic Gripper

IP.com Disclosure Number: IPCOM000039367D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Del Puerto, SE Gaschke, PM [+details]

Abstract

A gripper has been developed for picking and placing semiconductor modules during manufacturing operations. The device makes it possible to pick or place three modules at a linearly oriented hopper track station, change their relative orientation, and then place or pick them at a turntable station. In the manufacturing process three linearly arranged hopper tracks at the linear station (Fig. 1) have modules placed in either the pass 1 or fail 2 locations or picked from the untested 3 location. At the circular station, modules 4 are tested in the test socket 5 as the turntable 6 rotates (7). The task of the gripper is to place and pick the modules, as required, for testing and removal.