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Capping Method for Substrate Modules

IP.com Disclosure Number: IPCOM000039375D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Mauroschadt, RR Moore, RJ [+details]

Abstract

A method of capping substrate modules uses a spring-retention device which has low assembly force to minimize the possibility of damage. The method also acts as a heat transfer device and affords precise positive location of the module. The capping procedure works as follows. A thermal cap 1 (Fig. 1) serves as a heat sink when constructed in the manner shown in the drawing and placed over a ceramic substrate 2. The cap 1 holds the substrate 2 in the desired position when a spring retention clip 3 with projections 4 is placed over substrate 2, and projections 4 enter slots 5 of cap 1. (Image Omitted) The spring clip 3 retains the substrate 2 in the desired position in cap 1 when projection 4 grasps the bottom edge of the module 2, as seen in the cross-sectional view in Fig.