Local Photoresist Removal Device
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01
The production of multilayer printed circuit boards requires laminating layers of photoresist and MYLAR* sheets to copper panels. During this process, the photoresist is bonded to the copper and the MYLAR remains on the other side of the photoresist to protect it from impurities. The MYLAR and the photoresist cover the entire board, including the four locating holes, which must remain clear in order to properly locate the boards. A device to remove the resist and MYLAR from the holes is described in the following. (Image Omitted) This device was developed as a means of spot removal of photoresist and MYLAR to free the locator holes. A cutting edge permitted to penetrate only the MYLAR was introduced to both sides of the board to detach a circular slug of MYLAR around the locator hole.