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Robotic Hot Air Solder/Desolder Placement Device Disclosure Number: IPCOM000039421D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01

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Chu, KL Bleau, CD Wattenbarger, H [+details]


This article describes a device used with a robot to place, solder or desolder surface mount components automatically. Fig. 1 shows the device disclosed herein in partial cross-section. It is designed to place and solder surface mount components to a printed circuit (PC) board or to desolder the components and remove (Image Omitted) them during the rework process. In a soldering process, the vacuum pick up 1 picks up a component and places it on the PC board. Meanwhile, the component is encapsuled in the hot air chamber 2 of lower head assembly 3. Hot air flows from electric heater 4, passes through the passages in the upper head assembly and lower head assembly 3 and flows into the hot air chamber.