Browse Prior Art Database

Shield Arrangements

IP.com Disclosure Number: IPCOM000039472D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Aruga, N Ishii, S Matsushiba, T Okamoto, M [+details]

Abstract

As taking measures to ESD (Electro Static Discharge), a metallic shield plate produces a good effect on it. The shield plate is connected to ground by economical and practical contact means including a jumper and a mesh pattern of solder. Fig. 1 shows the shield arrangements including a shield plate 1 for a printed card 2. The shield plate 1 consists of a metal layer 1A (50 micron thickness, for example) and an insulator layer 1B (200 micron thickness, for example) pressed together. Preferably, the metal layer 1A is made of galvanized Fe, and the insulator layer 1B is made of polyvinyl chloride. The printed card 2 is provided with a jumper 3 which is grounded and has pins 3A and 3B protruding beyond the under surface of the printed card 2.