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Edge Photoresist Development Process and Exposure TOOL

IP.com Disclosure Number: IPCOM000039502D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01

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Related People

Agnihotri, RK Andrews, GG Quintana, DW [+details]


Residual photoresist remaining on the edge of a substrate is developed and removed in a solution to keep the edge of the substrate free of excess photoresist for the precise positioning of the subsequent mask plate. A knife-edge contact point tool is placed over the substrate to permit the exposure of only the edge without affecting the remaining photoresist layer placed on the substrate. A two-step development process is used to remove residual photoresist from the edges of the substrate for the precise positioning of the mask plate for the second development process. The photoresist layer is deposited onto the substrate by a spin process. A tool, such as shown in Figs. l and 2, is placed over the substrate or a plurality of the substrates. As shown in Fig.