Browse Prior Art Database

Thermal Conduction Module With Helical Pistons

IP.com Disclosure Number: IPCOM000039510D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Eid, JC Zumbrunnen, ML [+details]

Abstract

In a circuit module called a TCM (thermal conduction module), a metal structure called a hat is mounted above a thin square chip carrier and forms part of an enclosure for chips that are mounted on the chip carrier. Pistons, which are carried in downwardly-facing cylindrical holes in the hat, are spring loaded, and each contact a chip and carry heat from the chip upward to the hat. The hat is cooled by a cold plate that carries chilled water. (The orientation of the TCM in this description is arbitrary.) In this cold plate the pistons are helical and are threaded into the cylinders of the hat. A torsion spring rotationally biases each piston in a direction to move downwardly out of the cylinder to contact a chip.