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Rectangular Array of Circuit Components With Diagonal Flow of Coolant for Increased Turbulence and Improved Cooling of Downstream Components

IP.com Disclosure Number: IPCOM000039512D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Zumbrunnen, ML [+details]

Abstract

For cooling a rectangular array of circuit components, such as semiconductor chips or pistons or studs that are thermally connected to the chips, a coolant is flowed diagonally across the array. This flow pattern contrasts with the usual pattern in which the coolant flows along the rows of the array, or in a serpentine combination of rows and columns. Flow on a diagonal produces a significant turbulence in the coolant, and thereby improves the heat transfer. An inlet manifold extends along the two edges adjacent to the inlet corner and an outlet manifold extends along the two opposite edges adjacent to the outlet corner. The manifolds have a generally triangular shape along each edge to distribute the coolant appropriately.