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Solvent Blend for Epoxy Resin With Dicyandiamide

IP.com Disclosure Number: IPCOM000039585D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Summa, WJ Tong, HM Truong, PT [+details]

Abstract

A blend of 95% by weight propylene glycol monomethyl ether and 5% N- methyl pyrolidone is an effective solvent for dicyandiamide when used as a curing agent with epoxy resin. U.S. Patent 3,523,037 discloses epoxy resin compositions having a brominated epoxy resin, a tetrafunctional epoxy resin, dicyandiamide, and other elements as desired, which are dissolved and suspended in ethylene gylcol monomethyl ether. The resulting epoxy resin suspension may be stored for a limited period and is used to impregnate glass fabric, as is standard in the manufacture of printed circuit boards. The foregoing blend of the glycol ether and the pyrolidone is a good solvent for dicyandiamide. Such a solution is formed and then added to a solution of epoxy resins of the general kind described in the foregoing.