Browse Prior Art Database

Filtering Process for Vapor Phase Soldering Equipment

IP.com Disclosure Number: IPCOM000039595D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Klein, KV Seaman, RJ Weindorf, RC [+details]

Abstract

Vapor phase soldering solution must be filtered to remove dissolved and particulate solder flux residues. Failure to filter the solution properly results in degradation of the solution and equipment. A current filtering process used for vapor phase soldering is shown in Fig. 1. Periodically about once per day the solution 10 is drawn from the vapor phase soldering equipment sump 11 and cooled by an outside source 13 of cooling water to drop the temperature from the typical soldering temperature of 420oF to approximately 300oF . This initial cooling allows the solution to be pumped by pump 14 without damage to the pump seals and allows some of the dissolved flux residue to further precipitate.