Browse Prior Art Database

Improved Method of Residual Quartz Removal Using Multilayer Etch Mask

IP.com Disclosure Number: IPCOM000039621D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Fredericks, EC Isemin, DE Miller, MG [+details]

Abstract

In semiconductor manufacturing, quartz is often used as an insulator between conducting metal levels. Referring to Fig. 1, metal line 10 on substrate 12 has a conformal layer of quartz 14 applied as an insulator. When the quartz 14 is applied, a peak 16 often is formed over the metal line 10. After subsequent contact definition and etching, some residual quartz 18 can remain in the contact via as seen in Fig. 2. This can lead to subsequent problems. The addition of a layer of polymeric material on top of the quartz layer can minimize this problem. Referring to Fig. 3, a layer 20 which can be polyamic acid, polyimide, polyvinylcarbazole, polycarbonate, or polysulfone, with or without dyes or photo-sensitive agents, can be applied on the quartz layer 14 and baked.