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Illumination Method for Inspecting Solder Bonds of Surface-Mounted Components

IP.com Disclosure Number: IPCOM000039624D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Takahashi, Y Tsukamoto, K [+details]

Abstract

Certain surface-mounted components are soldered to a card at their side portions, resulting in solder bonds having raised and curved surfaces, as shown in Fig. 1. For inspection of such solder bonds by the use of a CCD camera, the combination of a circular lamp and a reflector, which are arranged to provide continuous illumination from all directions in the angle range of about 15o to about 55o with respect to the card, as shown in Fig. 2, has been found to provide clear and sharp image detection of the solder bonds. The circular lamp may be a conventional fluorescent lamp, and the reflector may be a white paper.