Stable Bath for Fast Electroless Copper Deposition
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01
In a bath containing a copper salt, ethylenediaminetetraacectic acid, sodium cyanide, a surfactant and formaldehyde (HCHO), the deposition rate is increased by increasing the HCHO content. Destabilization of the bath is prevented by dispersing a gas mixture, having a higher oxygen content than air, through the bath.