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Complementary Mosaic Packaging Concept Disclosure Number: IPCOM000039649D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-01

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Tsui, FF [+details]


A structure for providing power supply distribution, interchip connections, and a high circuit density is provided and comprises: complementary first and second substrates, each having a plurality of chips mounted thereon with their circuit sides facing away from the substrate, with their peripheral and center regions of the circuit sides used for interchip connections, and with the remaining area of the circuit sides used for circuits and areal input/output pads; power supply lines located between adjacent chips of each substrate; and studs for connecting the power supply lines of one substrate to pads of chips of the other substrate, wherein the chips of the substrates are arranged such that the chip corners of the chips of one substrate are adjacent the chip centers of the other substrate.