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Low-Cost Multilayer Flex Board and Ribbon Cable Disclosure Number: IPCOM000039763D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01

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Ledermann, PG [+details]


A method of producing a multilayer flex board or ribbon cable is provided and comprises: producing substrate layers comprising silicone adhesive on a polyimide film, punching holes in each substrate layer for vias, using the polyimide film to lift patterned copper lines from a plate; connecting the copper lines of the different layers by providing finished vias in the holes either by spot welding or by a solder paste and reflow technique, and providing a final cover layer which masks exposed lines while providing appropriate holes for components. The holes in the final cover layer typically expose or contain adhesive which permits surface mount components to be mounted without the need of additional adhesive.