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Contact Solder Reflow Frame

IP.com Disclosure Number: IPCOM000039870D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Cheng, CJ [+details]

Abstract

A constant-temperature-type contact frame solder reflow tool is shown in the figure. Using this tool, flexible foil, such as polyimide, can be circuitized and serve as a medium to join chips or substrate directly on the printed circuit board (PCB). The tool consists of a constant temperature bath 11 jacketed by a special-shape metal block. The thermal medium, such as DOWTHERM*, can be used as the heat transfer medium in the bath. Thermocouple sensor 13 and the temperature controller 14 are used to keep the temperature of the block at the required temperature level. The advantages of this tool are constant temperature throughout the surface of the head and, since the template contacts the top of the flexible circuitized foil, the possibility of undesirable component movement during reflow is minimized.