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Concept for Forming Multilayer Structures for Electronic Packaging

IP.com Disclosure Number: IPCOM000039923D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Curtis, SA Lukes, FJ Rakes, JM Schrottke, G [+details]

Abstract

Flexible circuits are formed by depositing, or adhesively bonding and etching, metallization on a film, typically polyimide or MYLAR*, in a pattern, forming a carrier for electronic components. A second wiring level can be accomplished on the reverse side of the film and the two layers interconnected through previously etched or punched vias in the film. Active and passive components, both pin-thru-hole and surface mount, can be affixed to the carrier using compatible soldering or conductive adhesive techniques. In recent years, integration of electronic functions onto increasingly complex chips with increasing numbers of Input/Output (I/O) leads has resulted in increasing difficulty in wiring the devices in 2 Signal (2S) configurations or in the area available.