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Aid for Electronic Package Lead Alignment

IP.com Disclosure Number: IPCOM000039990D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Munroe, RA [+details]

Abstract

A method is described which facilitates the alignment of leads during handling and mounting to a substrate. During lead frame fabrication, add a chemical and temperature-resistant electrical insulator to keep leads in alignment. The location should be so that subsequent forming and mounting operations are not hampered. The lead frame alignment aid could also be added after molding and before excising. During the excise operation, the selvage and mold dam bar are removed. They are usually metal parts of the lead frame designed to facilitate lead alignment and to limit mold flash. Once they are removed, the leads are formed. As electronic packages get smaller and have more leads, the leads are more easily deformed from their original position; yet the smaller more numerous leads require more critical alignment.