Browse Prior Art Database

Fast Thermal Cycling Thermode for Outer Lead Bonding of Decal and Similar Devices

IP.com Disclosure Number: IPCOM000040024D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Munroe, RA Wustrau, R [+details]

Abstract

In controlling the position of a constant temperature heat element 4 (Fig. 1), air pressure 2 forces the element against housing 6 for heat transfer and reflow of tab area 9 and pads on board 7. Air pressure 10 forces the element up and creates a forced-air cooling function through holes B radially spaced in housing 6. Insulator 3 forms a plenum 5, allowing forced air 1 to cool housing 6 through holes A. By controlling the position of heat element 4 and cycling air pressure 2 and 10 at specific times during a bonding cycle, a faster result is achieved.