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Controlled Forming of Pins Used With Pin Grid Array Modules

IP.com Disclosure Number: IPCOM000040031D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Lamarche, P Wauquier, E [+details]

Abstract

Pin grid array modules (metallized ceramic technology) have copper pins of cylindrical shape. For stiffness considerations the forming of these pins in order to obtain a "C" shape may be necessary. This invention allows a controlled and repetitive forming of all the pins of a module in one run. As it may be understood from the drawing, after module positioning in a mask, a translation is applied (step 1). Then, a pressure is applied in order to compress the pins (step 2). This pressure is transmitted by a piston guided by a clamp. Lastly, an opposite translation is applied in order to retrieve the initial pattern of the pin tips (step 3). However, the translations may be replaced by clockwise and anti- clockwise rotations, as well. All the directions of forming may be investigated.