Areal Contacting of Chips to Modules
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
Proposed is a system for high density areal contacting of chips to solder points on silicon modules. Generally, modules are electrically interconnected by solder reflow or wire bonding techniques. However, owing to the relatively large dimensions of the soldering points, these conventional techniques do not allow increasing the wiring densities on the module as would be desirable. According to this proposal, contacts to the soldering points are made by thin spiral or comb-shaped conducting silicon springs. The springs provide sufficient elasticity to tolerate the different thermal expansion of chips and modules. They are spring-loaded relative to the soldering points on the chip, thus permitting sequential point-by-point soldering of the connections.