Advanced Memory Card Package
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01
A method for creating an inexpensive way of packaging memory cards is described. The method involves packaging of memory devices on tape and then attaching the tape to a simple and inexpensive ceramic card to create an edge-connected-type memory. The first step in the method is to attach memory devices via a Tape Automated Bonding (TAB) process. Key to the step is the design of the tape which is made similar to conventional TAB; however, the tape used here contains lands (interconnection lines) that result in partial interconnection of the memory chip (Fig. 1). As an example, lands can be provided on the tape to interconnect the address lines from one chip to the next. In the same manner, the address lines of many chips can be connected together.