Browse Prior Art Database

Alternative Module Package

IP.com Disclosure Number: IPCOM000040067D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Carden, TF Cutting, LR Engle, SR Moore, RJ [+details]

Abstract

Packaging for thermally enhanced modules housing a semiconductor chip typically consists of an external heatsink bonded to an impact extruded cap. For internal thermal enhancement (ITE) either thermal grease or radial finger cooling (RFC) is used. The foregoing packaging concept has limitations, particularly regarding the manufacturability of the cap. A new packaging concept is described in the following. The module consists of a stamped cap 10 which is attached to substrate 11 by crimping. The cap 10 has a hole, or window 12, located directly over a chip 13. The module is then sealed by small shot size edge sealing. A cinderblock heatsink 14 is attached by means of a B staged epoxy 15 which is screened on the bottom side of heatsink 14, except for the ITE contact area.