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Ultimate Test and Retry Proposal Disclosure Number: IPCOM000040085D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

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Seward, MF [+details]


Current test equipment for testing high voltage leakage on printed circuit boards that use a Ditmco International Test Matrix have two inherent problems. One, the equipment employs a scanning technique to locate shorts that requires many retests on the defect to locate the addresses of the short on the unit under test. The extended time required for this test is occasionally responsible for changing the resistance of the defect above a resistance clip level where they are no longer detectable as shorts. These defects later return as shorts. Two, the Ditmco Test Matrix also has an inherent problem of not recording the correct "to" point address of a short if the test dwell time is inadequate. This makes it impossible to verify product shorts and repair them.