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Ingression-Resistant Process for Plastic Packages

IP.com Disclosure Number: IPCOM000040086D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-01

Publishing Venue

IBM

Related People

Authors:
Gons, S [+details]

Abstract

A process for reducing exposure to corrosive chemical ingression through cracks or delaminated plastic lead frame interfaces of integrated circuit (IC) plastic packages is reported. Corrosive chemicals, i.e., lead preparation acids and solder fluxes, are used in the assembly and card attachment of integrated circuits (ICs) plastic packages. When corrosive chemicals invade a package through cracks and delaminated interfaces, failure rates are aggravated by the corrosion of device-bonding pads in the package. By filling these voids in the package prior to exposure to corrosive chemicals used in the final process steps, device integrity is preserved and the risk of corrosion is reduced.