Pc-Based Driver Card for Stress Testing of Components Such As Integrated Circuit Chips
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
During sample stress test of components such as integrated circuit chips, for example, within an oven, each of the components is exercised and monitored under both high temperature stress and temperature cycling stress. The failure detection capabilities are limited to detecting functional failures. Parametric failures such as an output current being outside of the specification, for example, do not cause a functional failure that can be detected. An IBM prototype card 1 (Fig. 1A), which is employed with an IBM PC (personal computer), utilizes the output of a 74154 four-to-sixteen decoder 2 to selectively address one of twelve 74374 latch arrays 3-14 (Fig. 1B). The latch arrays 3-8 are used to write data from the PC to one of 48 chips to be exercised.