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Tcm Assembly: Component Alignment and Pre-Closure Disclosure Number: IPCOM000040263D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

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Feicht, D Pratz, J Ventimiglia, B [+details]


A method for alignment and pre-closure of the components of a circuit module to be encapsulated is described. The components are precisely aligned, then brought together under computer control to form a fixed assembly. The assembly may then be transported to a subsequent operation where the module is compressed and screws inserted. (Image Omitted) The module is comprised of a hat assembly 1 and cooling pistons 2, a lead seal band 3, a ceramic substrate 4, and a baseplate 5. The hat 1 is placed over a bottom plate 6 dedicated to that product type. Four seal band locating blades 7 are extended over the hat surface to form a nest for coarse seal alignment. After the seal band 3 is placed, another set of four blades 8 are extended.