Browse Prior Art Database

Use of High Precision Silicon Molds for Replicating Microelectronic Packaging Structures

IP.com Disclosure Number: IPCOM000040269D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Bassous, E [+details]

Abstract

Molding, stamping, embossing, extrusion and electroforming are mechanical replication techniques which offer the potential for generating high resolution, three-dimensional (3-D) patterns in a wide variety of materials for device applications. To extend these material-shaping processes down to micrometer dimensions, molds and dies are required (Image Omitted) which can be fabricated with a high degree of precision and at low cost. This disclosure suggests that silicon offers a unique combination of properties for this purpose. Silicon is an excellent material from which dies, molds and mandrels can be made because it possesses excellent mechanical and chemical properties combined with highly advanced patterning and microfabrication capabilities.