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Non-Physical Contact Wafer Pickup Head Disclosure Number: IPCOM000040270D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

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Related People

Frederick, JJ Jung, G Popp, G Tomkinson, A [+details]


A device for picking up and handling semiconductor wafers uses a Bernoulli-type pickup head with three sets of orifices to provide both wafer-handling capabilities and a contaminant-free zone along the path of travel. In the processing of semiconductor devices it is necessary to lift and move wafers at workstations. One method of doing this without physical contact between the wafer and handler is to use Bernoulli jets for pickup of the wafer, using additional jets for moving the wafer in a prescribed direction with no surface contact and minimal edge contact. It also provides a sweep of contaminants which would otherwise adversely affect the wafer. (Image Omitted) In Fig. 1 the pickup head 1 includes an annulus of Bernoulli jets 2 at angle a, as shown in Section 3-3 that provides the pickup feature.