Browse Prior Art Database

Flexible Manifold System for Supply and Return Connections to an Array of Liquid-Cooled Heat-Transfer Elements in a Circuit Module

IP.com Disclosure Number: IPCOM000040272D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Baron, JG Chrysler, GM Eid, JC Zumbrunnen, ML [+details]

Abstract

Heat-producing semiconductor chips are arranged in a row and column array on the upper surface of a substrate, and each chip is cooled by a liquid-cooled heat-transfer element that rests on the associated chip or is formed as an integral part of the chip, as is shown. Supply and return connections to a cooling liquid system are located at the top of each heat-transfer element. The supply and return connections are coaxial, and the return connection (aribtrarily) is located inside the supply connection. The manifold system has a lower sheet that is formed to connect flexibly to each heat transfer element at the outer supply connection and an upper sheet that connects to each heat transfer element at the inner return connection. The space between the first and second sheets carries supply liquid.