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Piping System With Valves Controlled by Processor for Heating Circuit Modules in a Selected Temperature Profile for Sealing Integrity Test Under Temperature Stress Disclosure Number: IPCOM000040283D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

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Buliszyn, S Zielinski, RQ [+details]


In a known sealing integrity test, circuit modules are heated by circulating hot water through the connections that are normally used for chilled water that removes heat from the modules. The module temperature is raised at a selected rate to a predetermined value, held at this temperature for a selected time interval, and then lowered to room temperature at a selected rate. A new test system provides a temperature signal to a processor that operates a set of valves that control a heater, a cooler, and a heat exchanger for this operation. A pump is connected to circulate water in parallel paths through several test modules and a thermally similar module that has a temperature sensor and is a permanent part of the test system.