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Circuit Module With Water-Cooled Piston Contacting Each Chip

IP.com Disclosure Number: IPCOM000040302D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Eid, JC Zumbrunnen, ML [+details]

Abstract

A circuit module has an array of semiconductor chips that are each cooled by contact with a water-cooled metal piston. Chilled water flows in passages near the surface of the piston. The chilled water enters the piston through an outer supply tube, and warmed water leaves the piston through an concentric inner return tube. A revised flow direction is also acceptable. The piston is formed of a cylindrical central core and an outer shell having a cavity that receives the core. The cavity has an inwardly facing cylindrical surface that fits tightly against the outer surface of the core in three embodiments of the piston. During manufacture, a helix is formed in the surface of the core. The helix can be formed turning the core on a lathe.