Browse Prior Art Database

Non-Contact Thermal Radiation Testing of Capacitors And/Or Chips on Multi-Chip Modules or Multi-Level Ceramic Modules

IP.com Disclosure Number: IPCOM000040305D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Prilik, RJ [+details]

Abstract

By means of the addition of infrared (IR) thermography to a normal module test system, individual capacitors and/or chips on modules are checked to determine whether they are emitting thermal radiation within a predetermined, acceptable range. Location and type of thermal radiation failures are determined as part of standard module testing. Referring to the figure, standard module tester 2 interacts with pin selection electronics package 4 to address selected input and output pins of a module, multi-chip module (MCM) or multi-level ceramic (MLC), 6. As is usual, ground plane connection B of module 6 under test is connected to the ground of tester 2. A voltage is normally supplied by supply 8 within tester 2 directly to Vdd input A of module 6 under test.