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Process for Fine Line Patterning

IP.com Disclosure Number: IPCOM000040308D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Holland, SP [+details]

Abstract

A process using a trilayer resist and double photo processing extends the capability of exposure tooling to provide smaller lines at higher density. (Image Omitted) Figs. 1-7 show a sequence of cross-sections formed by a process for creating a high density of fine lines in a conductive thin film. Referring to Fig.1, conductive film 4 is deposited on insulating substrate 2. Film layer 6 is a material that can be reactive ion etched (RIE) in oxygen or can be made resistant to oxygen RIE (hardened) by any of several treatments. The hardening treatment also makes the material of film layer 6 resistant to dissolution in commom solvents. Layer 8 is a material which is etchable in an oxygen RIE process and is not altered by being exposed to the hardening treatment, i.e.