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Cold Plate for Thermal Conduction Module With Inlet for Cooling Water Near Highest Power Chips

IP.com Disclosure Number: IPCOM000040325D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Hwang, UP [+details]

Abstract

A known circuit module has a planar rectangular array of semiconductor chips that are cooled by a cold plate. The cold plate has the same shape as the array of chips, and it is attached to the module with the bottom of the cold plate in thermal contact with the top of the module. Heat is conducted upward from the chips to the cold plate. The cold plate has inlet and outlet connections for chilled water. These connections are commonly located on top of the cold plate at diagonally opposite corners. An improved cold plate has the water inlet connection at the center and the outlet connection at one corner. Inside the cold plate, a rectangularly folded metal barrier strip extends in a spiral from the inlet position to the outlet connection to distribute the water over the floor of the cold plate.