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Enhanced Cooling of Thermal Conduction Module Disclosure Number: IPCOM000040334D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

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Bakhru, N Durand, R Wurms, C Torgersen, G [+details]


It is demonstrated that the cooling capacity of a thermal conduction module (TCM) semiconductor device can be enhanced by the inclusion of slots in the hat of the module. Cooling water circulated through the slots will be used to improve the thermal performance of the system. The hat of a module 2 fits over a substrate 3 containing chips 4. A piston 5 held in place by a spring 6 contacts the back of each chip to effect heat dissipation through the cold plate 7. An appropriate seal 8 is used between the housing and the substrate. The proposal suggests the cutting of slots 9 in the TCM hat in between the piston cavities. They should be cut as deeply as possible without affecting the mechanical integrity of the module. The slots are connected to coolant inlet and outlet manifolds.