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Pin Header Eject System

IP.com Disclosure Number: IPCOM000040336D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Bird, KA [+details]

Abstract

A modification has been proposed for machines producing input/output (I/O) pins for semiconductor devices. The development provides for using compressed air to effect the speedy removal of the pins so as to avoid jamming of the exit opening of the machine. In manufacturing pins for use in semiconductor substrates, a pin header machine fabricates the pins from coiled wire. In its operation the machine was subject to jamming due to the pins sticking to the eject punch and getting caught up in the eject bushing. A pin eject system was developed consisting of an outer bushing 1 and inner bushing 2. The outer bushing has a half-moon counter bore 15 cut in its top which prevents it from rotating and provides a secure mount under the rotary table 3 of the pin header machine.