Modules With Miniature Cold Plates Mounted Directly on Chips
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
In various modules, e.g., single-chip modules (SCMs), multi-chip modules (MCMs), thermal conduction modules (TCMs), etc., the heat dissipated by the chip must travel through a long thermal passage which is typically divided into two segments: an inner thermal passage from chip to module hat, and an outer thermal passage from the hat to the ambient via a heat sink, or to a fluid via a cold plate. The total thermal resistance (Rt) experienced by the heat dissipated by the chips is broken down into two phases in a similar fashion: an internal thermal resistance, Rint, and an external thermal resistance, Rext . The reduction of Rt(= Rint + Rext) value achieves better junction temperatures on chips and improves their reliability. This is described in the following single step heat transfer process.